[cprocess]

If the parts are stripped down to the plastic, it may be difficult to replate with good adhesion. The reason is that the original plater etched the plastic in a chromic acid based solution (etching must be controlled), then impregnated the etched pores with palladium (newer methods use tin and cobalt), plated over these impregnated metals with a nickel or copper solution(bridging across from pore to pore) until the plastic was completely incapsulated with a conductive metal. If the part is stripped to the plastic, overetching may occur, which may not allow the impregnating metals to tightly adhere to the plastic. My recommendation would be similar to the one posted previously, to use an inhibited stripper to remove the plating down to the encapsultion plate (could be nickel or copper, I have seen both). You will then have a tightly ahered conductive layer to reactivate and replate.