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EN mixture:
Nickel Salts: Sulfate, Sulfamate, Chloride Source of nickel
Reducer: Hypophosphite Boranes (DMAB) Reaction energy source for nickel to be available for reaction. "The Chemical Rectifier".
Chelators/complexors: Citric acid, Lactic acid, Malic acid Allows controlled amount of nickel to be available for reaction. Avoids a runaway reaction.
Buffers: Borate, Acetate, Succinate Inhibits dramatic pH changes
pH regulators: Ammonium hydroxide
Potassium carbonate
Sulfuric acid To adjust and maintain the operating pH
Stabilizers: Metallic - Pb, Sn, Mo
Organic: S Compounds Plating rate control and prevent uncontrolled plate out
Wetting Agents: bubble release and reduces pitting Controls solution's surface tension and H2



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