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The P&P manual gives the instructions for the "dip method". I would like to use this method however something is not clear. The photograph is small and not very clear. Instructions do not say exactly. It appears the anode is wrapped with the "bandage". I see the use for the bandage with the brush on method, but not the dip method.
I am trying to plate some small (1/8") "nails". I have to do copper then nickel. The instructions say to immerse the same surface area of anode as the part I'm plating. I don't see how I can control that area if I have a "bandage" wicking up the solution making the surface area difficult to control. Is the bandage supposed to be on the anode in the dip method like the photo appears to show? If yes, why and how should I control surface area? Thanks, Scott |
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Scott, I have the same questions. I would assume that the bandage is pretty much "invisible" and that I would use the surface area of the anode (the rod) whether I have the bandage on or not. But, I don't want to assume anything. Maybe someone who can help will be along soon? In the mean time, I'm going to watch the instructional video: http://www.sub-driver.com/movies/PNP-SVideo.mov |
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Well, Scott, I just watched the video and I'm not as keen on the idea now. Toward the end, the narrator says that because of the lack of control (mostly due to voltage) what often happens is that the part of your object closest to the anode will be slightly burned and the part furthest from the anode will not be completely plated.
I guess I'm going to have to buy one of the grown-up kits... |
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