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Using an idea from the plating manual, I have fabricated a plating tank that is 46" long and 5" in dia. I made a shorter one to flash copper and acid copper plate a tube that is 42" long and 1" in dia. The solution is being circulated by a pump and draining back into the larger tank.
My question is: as I lower the tube into the tank do I need to increase the current to accommodate the larger area of part being submersed? IE). 1 amp per 17sq". The anode length is only 24". And will there be more nickel on the part that has been in longer?
I am trying to achieve a bright nickel plate.
Does anyone have any ideas?
I think by typing 1 amp per 17 sq" I just answered my own question
My question is: as I lower the tube into the tank do I need to increase the current to accommodate the larger area of part being submersed? IE). 1 amp per 17sq". The anode length is only 24". And will there be more nickel on the part that has been in longer?
I am trying to achieve a bright nickel plate.
Does anyone have any ideas?
I think by typing 1 amp per 17 sq" I just answered my own question
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