We have some plating issues. We're amateurs. A few quick questions:
1. Is it possible to dilute the copper solution to the point where the mild sulphuric acid it contains will not detach the copper atoms from a copper anode? Our understanding is that the sulphuric acid that's placed in copper solution is what helps detach the copper atoms from the copper anode. We also understand that the anode is negatively charged, and the cathode is positively charged, thus causing the attraction of the copper atoms [in our case] to the cathode. Our cathodes are tree leaves that have been painted with CCP (conductive coating paint)
2. Is there any way to speed up a plating session. Our plating takes 8-9 hours. We're told that if we go any faster then we won't get the fine definition of the tree leaves (their veins and other characteristics). But we'd like to get it down to 6 hrs.
Believe me, I have more questions. I hope someone cal help us out with these two.
1. Is it possible to dilute the copper solution to the point where the mild sulphuric acid it contains will not detach the copper atoms from a copper anode? Our understanding is that the sulphuric acid that's placed in copper solution is what helps detach the copper atoms from the copper anode. We also understand that the anode is negatively charged, and the cathode is positively charged, thus causing the attraction of the copper atoms [in our case] to the cathode. Our cathodes are tree leaves that have been painted with CCP (conductive coating paint)
2. Is there any way to speed up a plating session. Our plating takes 8-9 hours. We're told that if we go any faster then we won't get the fine definition of the tree leaves (their veins and other characteristics). But we'd like to get it down to 6 hrs.
Believe me, I have more questions. I hope someone cal help us out with these two.
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