We have a research plating problem in which we need to plate a .004" thick layer of Copper on gold. Because the part is involved in a livetime process we must do this as rapidly as possible, preferably in 10 to 20 minutes. Is this possible and compatible with a highly adherent coating?? I understand the rule of thumb coating rate for acid copper is .001" per hour but the acid bath Caswell coating kit talks of coating .125" in several hours. This is nearly .001" per minute. Is this a pipe dream, typo or what
This is a very important issue for us.

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