After reading various threads on this forum, I used B-929 to remove the old nickel then sanded off the copper layer to bare pot metal. I then cleaned them in a heated ultrasonic cleaner with a mild alkaline cleaner then anodic electro cleaned them in 8-grams/liter sodium carbonate at 3.0 vdc for 5 minutes. After rinsing in distilled water, I plated them in alkaline copper starting at 700 mA for 15 seconds then 50 mA for 45 minutes. I then sanded with 1000 grit sandpaper, rinsed in distilled water and plated in alkaline copper for 45 minutes at 50 mA followed by sanding. The results were full coverage with excellent adhesion (tape test showed no delamination).
I am now going back to bare pot metal and will practice filling pits. I tried to sandblast the parts but blew them away. Would an “air eraser” (looks like a pen or air brush) using 220 grit aluminum oxide work just as well for removing chrome and plating prep on small parts?
The pits seem small – about 0.010” in diameter. Would a 1/64” drill provide a sufficient hole for filling with solder?
I plan to use 60/40 rosin core solder. What should be used to clean off the rosin flux after soldering?
If I understand the sequence correctly after drilling out the pits I should alkaline copper plate for 15 minutes then solder. Is that correct?